CC1100 DATASHEET PDF

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CC Texas Instruments RF Transceiver datasheet, inventory, & pricing. CC The CC is a low cost true single chip UHF transceiver designed for very low power wireless applications. The circuit is mainly intended for the ISM. Highly Integrated MultiCh RF Transceiver Designed for Low-Power Wireless Apps. Datasheet Texas Instruments CC

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The layer directly below the components should be a solid ground.

CC1100 Datasheet

Second it provides a low pass filter. The complete file can be obtained dafasheet the worldsens web site. With extensive capabilities for packet handling, data buffering, burst transmissions, clear channel assessment, and link quality indication, this chip is typically used with an on-board microcontroller. If one inductor is placed so that it has a very short straight trace, the other inductor will not fit in front of its corresponding pin.

The whole memory can be erased using the Bulk Erase instruction, or a sector at a time, using the Sector Erase instruction. As with the filter balun section, the ground plane below the trace must be solid up to the antenna.

However, the trace widths for the filter balun section itself should be as wide as possible without requiring a resize at the pads of the filter balun components in other words, you should make the traces from the CC to the filter inductors the same width as the CC pads.

It is often necessary to switch between layers in order access all of the connections required.

Although TI’s datasheets are invaluable in incorporating this chip into a particular design, cc1100 have still found some issues that are not addressed, particularly related to layout, and have written this article to fill in some of the gaps based on our own experience.

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Because the CC packaging has pins on all four sides, it can be difficult to connect things such as power.

Do not simply connect the two pins together and then route a single trace to the two capacitors. Filter Topology One of the key pieces of a design using the CC is the filter balun. Table of Contents 1. The memory is organized as 16 sectors, each containing pages.

We typically pair it with the MSP microcontroller, a decision we made before TI’s acquisition of Chipcon and which works especially well now that both are manufactured by the same company. This provides us with the ability to offer several options to our clients while using a consistent and proven transceiver architecture.

The effect of having the two sides with uneven layouts is higher harmonics especially the 2nd and 4th as well as reduced output power at the single-ended side of the filter balun. First it converts the balanced RF signals from the CC into an unbalanced signal.

CC Datasheet, PDF – Alldatasheet

Conclusion This article, if read in conjunction with the excellent TI application notes for this chip, will make it easier to incorporate the CC into your design. The architecture, combined with five low power modes is optimized to achieve extended battery life. Hardcover – pages July With a two-layer design, it becomes more complicated to achieve a solid ground.

The modem supports various modulation formats and has a configurable data rate of up to kBaud. The complete file can be obtained from the Worldsens web site. Hardcover – xatasheet June Schematic of the WSN board Figure 5-Incorrect Figure 6 – Acceptable Figure 7 – Correct Importance of decoupling capacitors to each pin When using the reference design provided by TI, it is important to understand that each decoupling component is included for a reason.

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TI also continuously works to improve their reference designs. Recommended PCB Layout for QLP 20 Package TI notes that this diagram is an illustration only and not to scale, and that there are five 10 mil via holes distributed symmetrically in the ground pad under the package that are not shown in the diagram.

In designing circuits using their components, Texas Instruments’ website provides very helpful documentation and design examples.

Note that the humidity sensor is optional and by default it is not build on the WSN node. The correct procedure is to route an individual trace from each pin to its associated capacitor. Layout Resources from Pegasus Technologies.

Chapter III. WSN Schematic

Design and layout is an art form, and never more so than when you are designing an RF circuit. However dqtasheet that is not possible, the next best approach is to minimize the amount of inductance within the trace by making it as wide as possible based on the size of the component pads.

The current version for the CC is CC Originally developed by ChipCon, this chip has continued as dataheet active TI product following their acquisition of ChipCon in early The MCP combines constant voltage, constant current regulation, cell preconditioning, cell temperature monitoring, advanced safety timers, automatic charge termination, and charge status and fault indication. The Texas Instruments MSP family of ultralow power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications.